MSC.Nastran Bibliography

Electronic Packaging/Electrical and Magnetic Structures

Archipley-Smith, Donna K.; Fong, Henry H. Electrical and Thermostructural Analyses of Potted High-Voltage Electronic Devices, MSC/NASTRAN Users' Conf. Proc., Paper No. 5, March, 1982. 

Belikov, Sergey; Martynov, Helen; Kaplinsky, Michael. Design of Rapid Thermal Processing System Based on MSC/NASTRAN Thermal Analysis, MSC 1995 World Users' Conf. Proc., Paper No. 21, May, 1995. 

Bellina, F.; Zaccaria, P. Full 3-D Stress Analyses of Complex Shaped Electrical Busbars Under High Electromagnetic Load, Proc. of the 15th MSC/NASTRAN Eur. Users' Conf., October, 1988. 

Brauer, J. R. MSC/NASTRAN Analysis of Electric Currents in Cathodic Protection Systems, Proc. of the MSC/NASTRAN Users' Conf., March, 1979. 

Cavalieri, F. Some MSC/NASTRAN Applications on Magnetic Fields in Electrical Machines, NASTRAN User's Conf., April, 1978. 

Chen, C. H. S. Linear Heat Analysis by MSC/NASTRAN and ADINA-T, MSC/NASTRAN Users' Conf. Proc., Paper No. 18, March, 1984. 

Chen, S. J.; Lee, E. Application of NASTRAN to TFTR Toroidal Field Coil Structures, Seventh NASTRAN Users' Colloq., pp. 247-278, October, 1978, (NASA CP-2062). 

Cifuentes, Arturo O. Finite Elements and Structural Mechanics in Electronic Packaging: Present and Future, The MSC 1990 World Users Conf. Proc., Vol. II, Paper No. 56, March, 1990. 

Cifuentes, A. O. Elastoplastic Analysis of Bimaterial Beams Subjected to Thermal Loads, ASME J. of Electronic Packaging, Vol. 113, pp. 355-358, December, 1991. 

Cifuentes, A. O.; Shareef, I. A Simple Finite Element Technique to Model the Stresses in the Fabrication of Multilayered Structures for Electronic Components, Proc. of the ASME Annual Meeting on Struct. Analysis in Electronic Packaging and Fiber Optics, December, 1991. 

Cifuentes, A. O.; Shareef, I. Manufacturing of Multilevel Structures: A General Method for Analyzing Stress Evolution During Processing, IEEE Trans. on Semiconductor Manufacturing, Vol. 5, No. 2, pp. 128-137, May, 1992. 

Cifuentes, A. O.; Stiffler, S. R. Modeling Thermal Stresses in Periodic Structures: Some Observations Regarding the Boundary Conditions, ASME J. of Electronic Packaging, Vol. 114, No. 4, pp. 397-402, December, 1992. 

Cifuentes, A. O.; Shareef, I. A. Some Observations Regarding the Determination of Thermal Stresses in Multilevel Structures, ASME J. of Electronic Packaging, September, 1993. 

Ciuti, Gianluca. Avionic Equipment Dynamic Analysis, MSC 1995 European Users' Conf. Proc., Italian Session, September, 1995. 

Cook, Peter S. NASTRAN Model of Anode Behaviour in Aluminium Reduction Cells, The Fifth Australasian MSC Users Conf. Proc., Paper No. 8, November, 1991. 

Cotner, John R.; McCann, Barbara A. Finite Element Thermal Analysis of Darlington Transistor Stack, MSC/NASTRAN Users' Conf. Proc., Paper No. 8, March, 1984. 

Di Sabatino, A.; Linari, M.; Muzi, F.; Paggi, R. Probabilistic Reliability Analysis of a Simulated Finite-Element Electromechanical System, Proc. of the 21st MSC European Users' Conf., Italian Session, September, 1994. 

Epping, Erin L. MSC/NASTRAN Transient Thermal and Thermal Stress Analysis of a Surface Mounted Chip Capacitor, MSC/NASTRAN Users' Conf. Proc., Paper No. 21, March, 1986. 

Hatheway, A. Random Vibrations in Complex Electronic Structures, MSC/NASTRAN Users' Conf. Proc., Paper No. 13, March, 1983. 

Hatheway, Alson E. Evaluation of Ceramic Substrates for Packaging of Leadless Chip Carriers, MSC/NASTRAN Users' Conf. Proc., Paper No. 16, March, 1982. 

Haylen, Peter. Reactions in a Turbogenerator Set Shaft Due to Electrical Disturbances, The Fifth Australasian MSC Users Conf. Proc., Paper No. 18, November, 1991. 

Henninger, P. NASTRAN Stress Analysis of a Winding Process, NASTRAN User's Conf., June, 1981. 

Hurwitz, Myles M.; Schroeder, Erwin A. Solving Magnetostatic Field Problems with NASTRAN, Seventh NASTRAN Users' Colloq., pp. 291-300, October, 1978, (NASA CP-2062). 

Kim, Gyu-Chool; Mo, Jin-Yong. Computational Prediction of Structural Fragility of TV Set, The MSC 1991 World Users' Conf. Proc., Vol. I, Paper No. 33, March, 1991. 

Li, D. C.; Chen, J. T.; Chyuan, S. W.; Sun, C. Y. Finite Element Analysis of Thermal Effects in an X-ray Mask, 1993 Symp. on Semiconductor Modeling and Simulation, March, 1993. 

Li, D. C.; Chyuan, S. W.; Chen, J. T; Sun, C. Y. Thermomechanical Response Analysis of Lithographic Mask Structure Using Finite Element Method, JSME International Journal, Vol. 38, No. 4, PP. 563-571, 1995. 

Morton, Mark H.; Layton, David S. A Finite Element Methodology for Predicting Relative Motion of Avionics Module Connector Contacts, The MSC 1993 World Users' Conf. Proc., Paper No. 41, May, 1993. 

Parameswaran, V. Thermal Design of Power Mosfets Operating in Parallel, MSC 1996 World Users' Conf. Proc., Vol. IV, Paper No. 31, June, 1996. 

Patel, Kirit V. Stress Analysis of Hybrid Pins in a Warped Printed Wiring Board Using MSC/NASTRAN, MSC 1995 World Users' Conf. Proc., Paper No. 20, May, 1995. 

Neal, M. Vibration Analysis of a Printed Wiring Board Assembly, Proc. of the MSC/NASTRAN Eur. Users' Conf., May, 1984. 

Newell, James M. Structural Analysis of a Thermoelectric Generator Element, MSC/NASTRAN Users' Conf. Proc., Paper No. 21, March, 1983. 

Nowak, William. Electro-Mechanical Response Simulation of Electrostatic Voltmeters Using MSC/NASTRAN, The MSC 1993 World Users' Conf. Proc., Paper No. 65, May, 1993. 

Reefman, R. J. B. Some Examples of MSC/NASTRAN Analyses in an Electrical Switchgear Factory, NASTRAN User's Conf., April, 1978. 

Rovang, Dean C. Pulsed Magnetic Field Coil Engineering at Sandia National Laboratories Using MSC/EMAS and MSC/NASTRAN, The MSC 1992 World Users' Conf. Proc., Vol. I, Paper No. 26, May, 1992. 

Schmitz, Ronald P. Structural Dynamic Analysis of Electronic Assemblies Using NASTRAN Restart/Format Change Capability, NASTRAN: Users' Exper., pp. 363-392, September, 1971, (NASA TM X-2378).