XXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXX''"> 1.2 Using this Guide
This guide is written for both new and experienced users of Patran and MD Nastran. It provides:
• practical, “how to” descriptions of thermal modeling, analysis, and results processing and visualization techniques
• descriptions of the relevant Patran menu forms
• basic engineering concepts and theory associated with MD Nastran's thermal solution capabilities
The Patran on-line help system provides logical and efficient access to all of this material.
The remainder of
Overview (Ch. 1), describes heat transfer basics. It discusses the concepts of thermal material properties, loads and boundary conditions, steady-state and transient analysis, and convergence criteria.
Getting Started - A Guided Exercise (Ch. 2), is designed to familiarize users quickly with the basic Patran menu interfaces to thermal modeling, steady-state analysis, and results processing. Before beginning, please review the Guided Tour at the top of the Patran on-line help system.
Building A Model (Ch. 3), describes Patran's menu forms for each phase of thermal modeling:
• Meshing the geometric model with finite elements
• Defining material properties
• Specifying element properties
• Applying loads and boundary conditions
Running a Thermal Analysis (Ch. 4), describes how to select steady-state or transient analysis solution types, define solution and subcase input data, select load cases, and submit the MD Nastran analysis job.
Results Processing and Visualization (Ch. 5), describes how to retrieve MD Nastran thermal analysis results into the Patran database. This chapter also summarizes the options for sorting and graphically rendering analysis results as contour or XY plots.
Example Problems (Ch. 7), presents more advanced engineering problems covering the following applications:
• Free convection on a printed circuit board
• Forced air convection on a printed circuit board
• Thermal contact resistance
• Typical avionics flow
• Radiation enclosures
• Axisymmetric flow in a pipe
• Directional heat loads
• Thermal stress analysis from directional heat loads
• Thermal stress analysis of bi-metallic plate
Files (App. A), describes the files created when using the Patran MD Nastran thermal preference product.
Error Messages (App. B) describes general error and diagnostic messages.
Supported Commands (App. C) describes the MD Nastran input data used “behind the scenes,” including File Management Statements, Executive Control Statements, Case Control Commands, and Bulk Data Entries.