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NAS104 - Thermal Analysis using MSC Nastran (SOLs 153 and 159)

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This seminar describes the latest heat transfer and thermal stress analysis capabilities in MSC Nastran. Program inputs and interpretation of results for conduction, convection, and radiation analyses are covered in detail. The seminar attempts to provide a balance between theory, its development within the context of MSC Nastran, and practical application. Example problems are used to clarify the information presented.
4 Days
Pre-requisites : 
Basic knowledge of heat transfer fundamentals. NAS101A (Linear Static and Normal Modes Analysis using MSC Nastran) or equivalent experience is recommended.

Day One

  • Introduction to MSC Nastran
  • MSC Nastran communication
    • Input data formats
    • Executive control statements
    • Case control statements
    • Parameter statements
  • Overview of heat transfer capabilities
    • Conduction
    • Convection
    • Radiation
  • The MSC Nastran thermal model
    • Geometry grid points and elements
    • Material properties
    • Boundary conditions surface elements
    • Thermal "loads"
    • Thermal transients

Day Two

  • NASTRAN input data
  • Steady state analysis (SOL 153)
    • NLPARM statement
    • Free and forced convection

Day Three

  • Steady state analysis (SOL 153) (cont.)
    • Thermal loads
    • Radiation boundary condition
    • Radiation view factors
    • Radiation enclosure analysis
    • Spectral exchange
  • Transient analysis (SOL 159)
    • TSTEPNL statement
    • Transient load methodology
    • Control nodes
    • Temperature boundary conditions
    • Phase change

Day Four

  • Thermal stress analysis
    • Restarts
  • Multimode heat transfer analysis
  • Thermal system analysis
  • Miscellaneous topics