MSC Software Corporation

PICLS is a thermal simulation tool which helps designers easily perform thermal simulation of PCBs. Even if you are unfamiliar with thermal simulation, you will obtain a simulation result without stress through the tool's easy and quick operation in 2D. You can import the data of a PCB created in PICLS to scSTREAM and HeatDesigner, that is, you can pass the analysis data seamlessly from the PCB design stage to the mechanical design stage.

Useful applications of PICLS

• Troubleshooting thermal issues of current products
• Examining thermal interferences of part layouts
• Consider heat release changes depending on a wiring pattern (coverage ratio)Examine the arrangement of thermal vias (e.g. location, number)
• Examine the arrangement of thermal vias (e.g. location, number)
• Examine the performance of a heat sink
• Examine the size of a PCB
• Examine the number of layers and the thickness of copper foil
• Consider natural/forced air cooling
• Consider radiant heat
• Considering heatsinks (number of fins, size
• Examining heat dissipation performances by connection to enclosure
• Considering PCB mounting environment

• External file interface
• Consideration of simple enclosure
• Heatsink
• Library
• Cutting out a PCB
• Preview
• Setting wiring pattern coverage ratio
• Placing thermal vias
• Setting mounting environment
• Displaying each layer
• Real-time display
• Report output
• Alert function
• Linking with thermo-fluid analysis

External file interface You can import IDF 3.0 and Gerber data

Consideration of simple enclosure You can consider heat dissipation by connection to enclosure

Heatsink You can allocate and display parts such as plate fins and heat dissipation plates

Library You can register and reuse created parts to the library

Cutting out a PCB Create a PCB of arbitrary shape by cutting out

Preview Check the layout of components in 3D

Setting wiring pattern coverage ratio Specify the area by rectangle and polygon

Placing thermal vias Specify through hole and IVH Specify filled via

Setting mounting environment Mount horizontally/vertically Consider forced air cooling and radiation

Displaying each layer Check each layer by selecting a focused layer

Real-time display Check component translation in real time

Report output Output analysis results as reports

Alert function You can check parts whose temperature is higher than threshold

Linking with thermo-fluid analysis Output CAB file for scSTREAM or HeatDesigner