Thermal Analysis
MSC의 열 해석 솔루션은 전도, 대류, 복사 등으로 분류되는, 열 전달에 대한 모든 상태를 포함한 열에 대한 반응을 해석할 수 있습니다. 열 복사 에너지 흐름의 산출에 중요한 복사 검증 요소들은 내부적으로 계산되거나 혹은 MSC 제품 사용자에게 옵션을 제공하는 타사 공급업체로부터 제공 받을 수도 있습니다. 또한 MSC 제품 내에서 국소 온도에 따라 재료 특성 및 경계 조건을 변화 시키거나 정확하고 원활하게 모델링 할 수 있습니다.
열에 대한 연구는 대부분 구조의 응답과 성능을 파악하기 위해 수행되고 있습니다. 엔지니어는 모델링의 필요에 따라 연쇄 또는 연성 해석을 수행하고, 응력 응답 및 파괴에 대해 온도 변화와 그에 따른 구조 거동에 미치는 영향에 대해 연구 할 수 있습니다. 열 응답을 포함한 멀티 피직스(Multi-Physics) 기능은 줄 가열(Joule heating) 및 전자기 효과를 고려해 실제 거동을 보다 정확하게 표현할 수 있습니다.
MSC Software 제품은 다양한 열 해석에 사용되고 있습니다:
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산업체 적용사례: |
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PCB model Advection – mass flow heat transfer |
Use MSC thermal solutions to model heat transfer problems that include conduction, convection, and radiation. Since convection is affected by the rate of fluid flow near a solid surface, the convection film coefficients depend on flow velocity. When parts are close, but not in full contact, heat transfer between them is highly nonlinear and should account for the gap between them. Another aspect that affects heat transfer is the dependence of properties and boundary conditions on the temperature. For an accurate solution, all these factors need to be accounted for. Whether you are looking for a steady state solution or a complete transient solution to better understand rate of thermal flow through various regions and parts of your model, MSC’s solutions enable you to include all the necessary physics for accurate simulation of your thermal systems. |
View factors |
The process of radiation is highly nonlinear. In addition to being dependent on temperature differential, radiation energy transmitted also depends on the viewing angle of a face with respect to thermal source. View factor calculations can be accomplished with efficient algorithms like Gaussian integration and the hemi-cube method, both available within MSC’s products and can provided as input for thermal analysis. |
Thermal contact between dissimilar meshes |
With thermal contact capabilities you can model the heat flow between components that are touching each other. The heat flux can be controlled by contact heat transfer coefficients, properties of the contacting material pair. |
Satellite
PCB with airflow |
MSC offers two key technologies for thermal analysis, namely, an FEA based solution and an RC network based solution. While FEA solution is used in most industries, RC network technology is also popular especially for aerospace, automotive, and electronic applications. The RC Network in particular may provide resource advantages for large models. By integrating two different thermal solution technologies MSC offers a common solution for all the industries and provides a uniform approach to include thermal effects in a structural run. |